Navid Asadi

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Packaging Part 21 - Thermal Challenges in Advanced Packaging
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Packaging Part 20 - Package Substrates
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Packaging Part 3 - Silicon Interposer
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Packaging Part 12 - Hybrid Bonding 1
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Supply Chain Security - Navid Asadi: Physical Assurance and Inspection of Electronics
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Packaing Part 4 - 2.5D and 3D
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Packaging part 7 - System in Package
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Divine Answer - Navid Asadi
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SCAN Lab Tour - LINK TO THE LAB VR TOUR IN THE DESCRIPION
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