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| Name | [Fab Part1] All About Silicon Wafers |
| Video Uploader | Video From SemiSlides |
| Upload Date | This Video Uploaded At 25-05-2023 14:26:18 |
| Video Discription | Welcome to "All about Silicon Wafers," your comprehensive guide into the essential component of today's semiconductor technology. This video provides an in-depth exploration of silicon wafer creation, processing, and application, offering insightful access into the semiconductor industry. In this episode, we'll be delving into: 1. The crucial role of silicon wafers in the world of semiconductors. 2. The evolution of silicon wafer sizes over the years and its implications on the industry. 3. Single-side polishing vs. double-side polishing: their purpose and differences. 4. The significance of notch and flat zone alignment for correct wafer orientation. 5. A comparison of (100) and (111) wafer breaks and their importance in manufacturing. 6. The Siemens process, a key method for polysilicon chunks. 7. The Czochralski process, a standard procedure for creating high-quality silicon ingots. 8. Ingot quality parameters and their impact on the final wafer and device performance. 9. The intricacies of wafer processing, which include slicing, edge rounding, lapping, etching, and polishing. 10. The role of epitaxy and epi wafers in advanced semiconductor manufacturing. 11. Essential quality control aspects, including TTV, bow, warp, and particle inspection. 12. The influence of off-cut angles in ion implantation channeling. 13. An in-depth understanding of FDSOI (Fully Depleted Silicon-On-Insulator) devices and wafers. 14. An overview of the major silicon wafer manufacturers and their market share. Whether you're just stepping into the semiconductor field or a seasoned expert looking to broaden your understanding, this video serves as a rich resource, shedding light on silicon wafers and their transformative role in the landscape of technology. Don't miss this opportunity to learn and grow! Show your support by subscribing, liking, and turning on notifications to stay updated with our latest content. Relevant resources featured in this video: 1. Siemens process by wacker Chemistry AG: https://youtu.be/eypAfmrRpB0 2. Czochralski process by Microchemicals: https://youtu.be/2qLI-NYdLy8 3. 300mm Si wafering process by SK Siltron: https://youtu.be/yeUUzgE70XA 4. Epitaxial CVD by Siltronic AG: https://youtu.be/TZxD2ePrphY 5. FD-SOI introduction by ST Micron: https://youtu.be/uvV7jcpQ7UY 6. Smart-cut technology for SOI wafers by Soitec: https://youtu.be/3VemFLbZEsE This content was produced with Typecast, an AI virtual actor service. Characters casted: Aden & Macy https://typecast.ai |
| Category | Science & Technology |
| Tags | 300mm | Silicon | Wafer | Semi Sherpa | Defect Density | semiconductor | doping | band gap | SiO2 | selectivity | earth's 2nd crust | notch | flat zone | single side | double side | SOI | silicon on insulator | sapphire | (100) | (111) | F-type | R-type | Czochralski | SK siltron | Ingot | Air pocket | Boron distribution | Oxygen distribution | epi CVD | off-cut | channeling | flatness | TTV | Bow | Warp | Particle | FD-SOI | Smart Cut | Soitec | sunco | siltronic AG | GlobalWafers | ShinEtsu | Siemens process | Quartznite | polysilicon chunks |
